发明名称 WOOD FILM AND METHOD OF MOLDING THE SAME
摘要 According to an example embodiment, a wood film includes a patterned wood film, a non-woven fabric attached to a surface of the patterned wood film, and a resin film attached to a surface of the non-woven fabric. According to an example embodiment, a method of molding a wood film includes attaching a non-woven fabric to a first surface of a patterned wood film, attaching a resin film to a surface of the non-woven fabric, grinding a second surface of the patterned wood film to reduce a thickness of the patterned wood film to form the wood film, and molding a portion of the wood film into a desired shape by pressing and heating the wood film using a press mold. The second surface of the patterned wood film is opposite to the first surface of the patterned wood film.
申请公布号 US2012082827(A1) 申请公布日期 2012.04.05
申请号 US201113180901 申请日期 2011.07.12
申请人 BAE AH HYUN;SON SANG IK;JIN JAE CHUL;HONG SEOK HYUN;PARK HOON SOO;SAMSUNG ELECTRONICS CO., LTD. 发明人 BAE AH HYUN;SON SANG IK;JIN JAE CHUL;HONG SEOK HYUN;PARK HOON SOO
分类号 B32B21/10;B29C45/14;B32B38/10 主分类号 B32B21/10
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