| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wireless apparatus which has a built-in antenna in a package, and an antenna characteristic improved. <P>SOLUTION: A wireless apparatus of an embodiment comprises: a mounting substrate which has a conductor pattern; a substrate which has the conductor pattern; a semiconductor chip mounted on one surface of the substrate; and an antenna which has a conductive element formed on the one surface, and is connected with the semiconductor chip. The wireless apparatus includes a semiconductor package implemented in the mounting substrate and a plurality of connection parts which connect between the mounting substrate and the substrate, and a first electric length of a first connection part nearest to the conductive element among the plurality of connection parts or a second electric length including the first connection part and the conductor pattern of the mounting substrate or the substrate which are connected to the first connection part is less than 1/2 wavelength of a use frequency of the antenna. <P>COPYRIGHT: (C)2012,JPO&INPIT |
