| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing method hardly scattering end materials and capable of producing a greater number of electronic component chips from one wafer sheet. <P>SOLUTION: In the dicing method for dicing a wafer 4 using a dicing blade 5, in order to form a plurality of second dicing lines 12 extending to a direction orthogonal to first dicing lines 11 after forming a plurality of the first dicing lines 11, a step for forming the second dicing lines 12 includes: (b1) a step for starting dicing from one end of the wafer 4 toward a second direction and completing dicing at the internal wafer 4; (b2) a step for rotating the wafer by 180 degrees in an internal wafer plane direction; and (b3) following the (b2) step, a step for forming the second dicing lines 12 in a manner to dice the wafer toward the second direction in continuation to a dicing line portion 12a formed in the (b1) step. <P>COPYRIGHT: (C)2012,JPO&INPIT |
