发明名称 |
METHOD FOR MANUFACTURING A FLEXIBLE ELECTRONIC DEVICE USING A ROLL-SHAPED MOTHERBOARD, FLEXIBLE ELECTRONIC DEVICE, AND FLEXIBLE SUBSTRATE |
摘要 |
The objective of the present invention is to solve the problems of degraded performance and yield of a flexible electronic device due to low processable temperature, high surface roughness, high thermal expansion coefficient, and poor handling characteristics of existing flexible substrates. The method for manufacturing a flexible electronic device according to the present invention comprises the steps of: forming a flexible substrate on a roll-shaped motherboard; separating the flexible substrate from the roll-shaped motherboard; and forming an electronic device on a separated surface of the flexible substrate that contacted the motherboard. |
申请公布号 |
WO2012043971(A2) |
申请公布日期 |
2012.04.05 |
申请号 |
WO2011KR04694 |
申请日期 |
2011.06.28 |
申请人 |
POSTECH ACADEMY-INDUSTRY FOUNDATION;LEE, JONG LAM;KIM, KEE SOO |
发明人 |
LEE, JONG LAM;KIM, KEE SOO |
分类号 |
H01L51/56;G02F1/1333;G02F1/167;H01L29/786 |
主分类号 |
H01L51/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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