发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY, ELECTRONIC COMPONENT ASSEMBLY, ELECTRONIC APPARATUS, AND SIGNAL LAMP FOR VEHICLE
摘要 <P>PROBLEM TO BE SOLVED: To reduce waste which is cut out of a lead frame in the case where an electronic component is assembled using a lead frame. <P>SOLUTION: In an electronic component assembly 10, a plurality of support conductors 22-28 are provided in band, being separated from each other, and arrayed along length direction. A plurality of feeding holes 51 and 52 are opened on the support conductors 22-28, being arrayed along the length direction of the support conductors 22-28. Light emitting diodes 70, 70, ..., a resistor 60, and a diode 61 are connected among the support conductors 22-28. With the support conductors 22-28 acting as a wiring, the support conductors 22-28, the light emitting diodes 70, 70, ..., the resistor 60, and the diode 61 constitute a circuit. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012069615(A) 申请公布日期 2012.04.05
申请号 JP20100211535 申请日期 2010.09.22
申请人 STANLEY ELECTRIC CO LTD 发明人 TAKEMURA JUN;ICHIKAWA TOMONORI;KAMIKAWA TOSHIMI
分类号 H05K7/00;F21S8/10;F21Y101/02;H01L23/48;H01L33/62 主分类号 H05K7/00
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