发明名称 INSULATION SHEET AND LAMINATE STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an insulation sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m K or more to a conductive layer, low in elastic modulus of a cured product after curing, and high in heat resistance and withstand voltage of the cured product. <P>SOLUTION: An insulation sheet according to the present invention is used for bonding a heat conductor having a thermal conductivity of 10 W/m K or more to a conductive layer. The insulation sheet according to the present invention includes: a polymer having a weight average molecular weight of 10,000 or more; an epoxy resin having an alkylene ether structure with 2-6 carbon atoms; a hardener having no aromatic skeleton; and a filler. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012069425(A) 申请公布日期 2012.04.05
申请号 JP20100214248 申请日期 2010.09.24
申请人 SEKISUI CHEM CO LTD 发明人 AOYAMA TAKUJI;MAENAKA HIROSHI;KUSAKA YASUNARI;TAKAHASHI RYOSUKE;KONDO SHUNSUKE;INOUE TAKANORI;YAMADA YU;WATANABE TAKASHI
分类号 H01B3/00;B32B15/092;B32B27/38;C08G59/20;C08G59/42;C08K3/00;C08L63/00;C08L101/00;H01B17/56 主分类号 H01B3/00
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