发明名称 PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To form a conductor pattern having good electrical characteristics while ensuring sufficient production efficiency. <P>SOLUTION: The manufacturing method of a printed wiring board includes a step S11 for forming an insulation resin layer containing inorganic filler at a content of 30 wt% or higher, a step S12 for forming a conductor on the insulation resin layer, and a step S14 for forming a conductor pattern on the insulation resin layer by irradiating the conductor with a laser beam thereby dividing the conductor or narrowing the width of the conductor. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012069924(A) 申请公布日期 2012.04.05
申请号 JP20110176108 申请日期 2011.08.11
申请人 IBIDEN CO LTD 发明人 NAKAI TORU;AMANO TETSUO;TAKASAKI YOSHINORI
分类号 H05K3/08;B23K26/00;B23K26/36;H05K3/00 主分类号 H05K3/08
代理机构 代理人
主权项
地址