发明名称 |
SOLAR SUBSTRATE RIBBON BONDING SYSTEM |
摘要 |
An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates. |
申请公布号 |
US2012080507(A1) |
申请公布日期 |
2012.04.05 |
申请号 |
US201113251741 |
申请日期 |
2011.10.03 |
申请人 |
LUECHINGER CHRISTOPH B.;VALENTIN ORLANDO L.;ORTHODYNE ELECTRONICS CORPORATION |
发明人 |
LUECHINGER CHRISTOPH B.;VALENTIN ORLANDO L. |
分类号 |
B23K20/10;B23K37/00 |
主分类号 |
B23K20/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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