PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve heat radiation performance by forming a heat radiation pattern in a dummy area. CONSTITUTION: A base substrate(110) includes an insulation layer(115). The insulation layer is divided into a circuit area(A) and a dummy area(B). The dummy area is formed in the frame of the circuit area. A circuit layer(120) is formed on the circuit area of the insulation layer. The circuit layer includes a circuit pattern(125) and a via(127). A heat radiation pattern(130) is formed by filling a cavity(135). The cavity is formed in the dummy area of the insulation layer.