| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an encapsulant for an optical semiconductor device, which is not apt to lead to a reduction in luminosity and hardly causes discoloration, even when being used under such condition that the optical semiconductor device is energized in a harsh, high-temperature and high-humidity environment. <P>SOLUTION: The encapsulant for an optical semiconductor device contains: a first organopolysiloxane having an alkenyl group bonded to a silicon atom and an aryl group bonded to a silicon atom, and not having a hydrogen atom bonded to a silicon atom; a second organopolysiloxane having a hydrogen atom bonded to a silicon atom and an aryl group bonded to a silicon atom; and a platinum alkenyl complex. The platinum alkenyl complex is a product of a reaction between a chloroplatinic acid hexahydrate and six or more equivalents of an alkenyl compound comprising two or more functional groups. The ratio of the number of alkenyl groups bonded to a silicon atom in the whole organopolysiloxane in the encapsulant, to the number of hydrogen atoms bonded to a silicon atom in the whole organopolysiloxane in the encapsulant is 1.0-2.5. <P>COPYRIGHT: (C)2012,JPO&INPIT |
