| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the radiating property of heat generated in an electronic component, and to reduce influences due to electromagnetic noise. <P>SOLUTION: A radiating structure comprises a circuit substrate 13 which is disposed in an outer housing 2, has a component mounting portion 17 and ground portions 13c and 13d connected to a ground circuit, and is mounted with an electronic component 18 functioning as a heat source during driving on one surface of the component mounting portion; a heatsink 14 which is disposed on a surface side on which the electronic component of the circuit substrate is mounted, and emits heat generated in the electronic component; a radiating plate 16 which is disposed on the opposite side to the side on which the electronic component is mounted over the circuit substrate, and has a platy base portion 16a and a projecting portion 16b projected out to the circuit substrate side from the base portion and formed with an opposite surface 16c opposing to the other surface of the component mounting portion; and a first heat transmission body 23 which is stuck to the other surface of the component mounting portion of the circuit substrate and the opposite surface in the projecting portion of the radiating plate, and transmits heat generated in the electronic component to the radiating plate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
