| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which solder bumps are not broken, unnecessary bending force is not applied to a semiconductor package, the solder bumps do not follow up the mounting substrate, and reliability can be maintained. <P>SOLUTION: A relay substrate 3 satisfying a relation E1>E3>E2 is used, where E1, E2 and E3 are Young's moduli of a semiconductor package substrate 1, the relay substrate 3 and a mounting substrate 2, respectively. Following relation is satisfied; pitch between terminals L1=pitch between terminals L2<pitch between vias L3. In such a relation L1=L2<L3, the connection distance L5 of a solder bump on the side is longer than the distance between centers (connection distance) L4 of bonding regions at both ends of a central solder bump. <P>COPYRIGHT: (C)2012,JPO&INPIT |
