发明名称 Electronic Assemblies and Methods of Forming Electronic Assemblies
摘要 An electronic assembly includes an electronic device having high-resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and an electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.
申请公布号 US2012081868(A1) 申请公布日期 2012.04.05
申请号 US201113082367 申请日期 2011.04.07
申请人 发明人 DEPAULA ANDREW;AAMODT LARRY;VYHMEISTER RONALD
分类号 H05K7/06;H05K3/12 主分类号 H05K7/06
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