发明名称 |
Electronic Assemblies and Methods of Forming Electronic Assemblies |
摘要 |
An electronic assembly includes an electronic device having high-resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and an electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.
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申请公布号 |
US2012081868(A1) |
申请公布日期 |
2012.04.05 |
申请号 |
US201113082367 |
申请日期 |
2011.04.07 |
申请人 |
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发明人 |
DEPAULA ANDREW;AAMODT LARRY;VYHMEISTER RONALD |
分类号 |
H05K7/06;H05K3/12 |
主分类号 |
H05K7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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