ELECTRONIC COMPONENT MOUNTING METHOD

摘要

According to an electronic component mounting method of the present invention, a component is mounted in a mode in which a bump is earthed to an electrode by way of a thermosetting flux formed by blending a first active constituent with a first thermosetting resin, a resin reinforcement material formed by blending a second active constituent with a second thermosetting resin is brought into contact with a reinforcement site of an electronic component (1), and a substrate is then heated, so that a solder joint is formed joining the bump and the electrode and also a resin reinforcement section is formed reinforcing the solder joint from the periphery thereof. With respect to the blending compositions of the thermosetting flux and the resin reinforcement material, the blending ratio of the second active constituent is larger than the blending ratio of the first active constituent.