| 摘要 |
<p>The adhesive (3) is coated on contacting region (4) of a semiconductor substrate (1), and a strip guard pattern (2) is formed in contacting region. The solder material (17) is brought in contact with contacting tubs (6) in strip guard, and applied on a contact portion (12) of a semiconductor chip (9). The contact portion of chip is made to project into contacting tub. The chip and contacting region of substrate are heated such that the chip is adhered with the substrate, and the chip contact portions are made to contact with contact surface (2.1) of strip guard pattern. An independent claim is included for circuit device.</p> |
