| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method which, in a mounting manner where electronic components with bumps are fastened to the board by using a resin reinforcement material partially for reinforcement, can effectively prevent bondability from being reduced for reasons that electrodes are locally covered by a resin reinforcement material. <P>SOLUTION: In an component mounting manner where a bump 2 is landed on an electrode 6 via a thermosetting flux 8 composed of a first thermosetting resin which has had a first active component mixed thereto, and after a resin reinforcement material 10 composed of a second thermosetting resin which has had a second active component mixed thereto is contacted with a reinforcement spot 1a of an electronic component 1, a board 5 is heated to form a solder joining part 2* where the bump 2 and the electrode 6 are joined and also to form a resin reinforcement part for reinforcing the solder joining part from the periphery, a mixing composition of the thermosetting flux 8 and of the resin reinforcement material 10 is such that a compounding ratio of the second active component is larger than that of the first active component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
