| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device with a flexible protective material formed on a surface thereof, which can maintain high yield without causing the protective material to adhere on a terminal part even though the protective material is displaced at the time of installing the protective material or performing adhesion treatment. <P>SOLUTION: When a terminal part 104 provided on a substrate 100 has a length of 5 mm or less, a step layer with a thickness of 0.38X or more and 2 mm or less is provided on an element part where X is the length of the terminal part 104. Thus, a space can be provided between a surface of the terminal part 104 and a protective material 110 even though the protective material 110 installed on the step layer so as to cover the element part overlaps on the terminal part 104. In this state, the protective material 110 and the substrate 100 may be attached together using an attachment member 116 including an elastic material with a surface hardness of 50 or more and 100 or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
