| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection structure which makes it possible to reduce variations in the strength of substrate-to-substrate adhesion in a shorter adhesive heating time than ever. <P>SOLUTION: A connection structure 1 electrically connects two substrates 3. The connection structure 1 comprises adhesive filling grooves 5 provided sandwiching a connection terminal 2, in which an adhesive 4 is filled, and a plurality of channels 9 each consisting of a communication groove 6 which permits two adhesive filling grooves 5 sandwiching a connection terminal 2 to communicate, in which the adhesive 4 flows while the connection terminals 2 of the two substrates 3 are in an opposed state. One of the channels 9 is such that the flow resistance of the adhesive 4 flowing from an adhesive filling groove 5a on one side to an adhesive filling groove 5b on the other side is smaller than that flowing from the adhesive filling groove 5b on the other side to the adhesive filling groove 5a on the one side, and the other channel 9 is such that the flow resistance of the adhesive 4 flowing from the adhesive filling groove 5b on the other side to the adhesive filling groove 5a on the one side is smaller than that flowing from the adhesive filling groove 5a on the one side to the adhesive filling groove 5b on the other side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
