| 摘要 |
The invention relates to a flame-retardant polyamide molding composition based on semicrystalline polyamides. This polyamide molding composition is based on (A) from 30 to 92% by weight of at least one aliphatic or semiaromatic, semicrystalline polyamide with melting point (Tm) in the range from 240° C. to 340° C.; (B) from 0 to 50% by weight of at least one filler and reinforcing agent; (C) from 8 to 18% by weight of at least one halogen-free flame retardant; (D) from 0 to 2.0% by weight of at least one barium carboxylate; (E) from 0 to 5% by weight of at least one additive; wherein the percentages by weight of components (A) to (E) give a total of 100%, and with the proviso that if the proportion of component (D) is in the range from 0 to 0.1% by weight the halogen-free flame retardant of component (C) is based on a barium phosphinate. The invention further relates to the use of barium carboxylate in a polyamide molding composition using a halogen-free flame retardant for inhibiting corrosive action during processing. The molding compositions comply with fire-protection class UL 94 V-0, and have no, or only slight, corrosive action with respect to the machine components used in thermoplastic processing, and exhibit good mechanical properties. They are suitable for producing, in particular, thin-walled moldings for the electrical and electronics industry, examples being housings, housing components, and connectors.
|
