LAMINATE COMPRISING AN EPOXY RESIN AND HAVING SUPERIOR FORMABILITY, AND METHOD FOR PRODUCING SAME

摘要

The present invention relates to a laminate for a metal base printed circuit board, comprising a printed circuit layer, an insulation layer, and a metal heat-dissipating layer. More particularly, the present invention relates to a laminate for a metal base printed circuit board, in which a resin composition for the insulation layer comprises a mixture of high equivalent weight epoxy and low equivalent weight epoxy, and a large amount of inorganic filler, thus enabling the laminate to have superior formability such as bendability, punchability, adhesive strength, and the like, as well as high heat conductivity and excellent electrical properties such as withstanding voltage and the like. Particularly, the metal base printed circuit board made of the laminate of the present invention exhibits optimum performance in an overall formability test.