| 摘要 |
<P>PROBLEM TO BE SOLVED: To check displacement including rotational deviation, that is twist, of electronic components in a plane vertical to a mounting direction before bonding. <P>SOLUTION: A mounting method comprises the steps of: holding an electronic component 22 having ball-shaped bumps 25 on a surface thereof, in a placing head 20; displacing the placing head toward a mounting board while positioning of both the electronic component and the mounting board are conducted so as to press the bumps onto electrodes formed on a mounting surface of the mounting board; and bonding the bumps thereto by fusing the bumps in a state of pressure contact. When the electronic component held in the placing head is positioned and applied pressure contact against the mounting board, the placing head is subjected to two loads in a same direction, which are generated in a plane vertical to a mounting direction, and the two loads are measured by load measuring means S arranged at two separate points in the vertical plane so that displacement of the bump and the electrode are detected. <P>COPYRIGHT: (C)2012,JPO&INPIT |
