| 摘要 |
A semiconductor package includes a first package including a first substrate and at least one first semiconductor chip mounted on the first substrate, a redistribution wiring layer provided on the first package and including a connection pad, a bonding pad electrically connected to the connection pad and a dummy bonding pad electrically connected to the bonding pad, a second package stacked on the first package via the redistribution wiring layer and electrically connected to the connection pad of the redistribution wiring layer by a first connection member, a bonding wire electrically connecting the bonding pad to the first substrate, and a dummy bonding wire electrically connecting the dummy bonding pad to the first substrate.
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