发明名称 METHOD FOR PROCESSING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS
摘要 There is provided a substrate processing method, comprising the steps of: supplying source gas into a processing chamber in which substrates are accommodated; removing the source gas and an intermediate body of the source gas remained in the processing chamber; supplying ozone into the processing chamber in a state of substantially stopping exhaust of an atmosphere in the processing chamber; and removing the ozone and the intermediate body of the ozone remained in the processing chamber; with these steps repeated multiple number of times, to thereby form an oxide film on the surface of the substrates by supplying the source gas and the ozone alternately so as not to be mixed with each other.
申请公布号 US2012079985(A1) 申请公布日期 2012.04.05
申请号 US201113313736 申请日期 2011.12.07
申请人 YAMAZAKI HIROHISA;TAKEBAYASHI YUJI;SAKAI MASANORI;KATO TSUTOMU;HITACHI KOKUSAI ELECTRIC INC. 发明人 YAMAZAKI HIROHISA;TAKEBAYASHI YUJI;SAKAI MASANORI;KATO TSUTOMU
分类号 C23C16/455 主分类号 C23C16/455
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