| 发明名称 |
Light emitting diode sealing member and method for producing light emitting diode device |
| 摘要 |
<p>A light emitting diode sealing member (1) includes a light emitting diode sealing layer (2), and a lens mold layer (3) laminated on the light emitting diode sealing layer. The light emitting diode is formed by molding both layers together in one step.</p> |
| 申请公布号 |
EP2437320(A2) |
申请公布日期 |
2012.04.04 |
| 申请号 |
EP20110183087 |
申请日期 |
2011.09.28 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
SHINBORI, YUKI;OOYABU, YASUNARI;SATO, SATOSHI;ITO, HISATAKA |
| 分类号 |
H01L33/54;H01L33/56;H01L33/58 |
主分类号 |
H01L33/54 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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