| 摘要 |
PURPOSE: A substrate in which a semiconductor chip is included and a stacked semiconductor package including the same are provided to expose one surface of the semiconductor chip to the outside of the substrate, thereby effectively releasing heat generated from the semiconductor chip. CONSTITUTION: A cavity is formed on one surface of a first substrate(110). A plurality of terminals which is electrically connected to the outside is formed on a first semiconductor chip(130). The first semiconductor chip is arranged on the cavity in order to electrically connect the terminals to the first substrate. The other surface of the first semiconductor chip is exposed to the outside of the first substrate. A second substrate(120) is laminated on the other surface of the first substrate. |
