<p>A method of forming a fluid chamber and a source of fluid impedance includes providing a substrate having a surface; depositing a first material layer on the surface of the substrate, the first material layer being differentially etchable with respect to the substrate; removing a portion of the first material layer thereby forming a patterned first material layer and defining the fluid chamber boundary location; depositing a sacrificial material layer over the patterned first layer; removing a portion of the sacrificial material layer thereby forming a patterned sacrificial material layer and further defining the fluid chamber boundary location; depositing at least one additional material layer over the patterned sacrificial material layer; forming a hole extending from the at least one additional material layer to the sacrificial material layer, the hole being positioned within the fluid chamber boundary location; removing the sacrificial material layer in the fluid chamber boundary location by introducing an etchant through the hole; forming the fluid chamber by introducing an etchant through the hole; and forming a source of fluid impedance.</p>
