发明名称 Barrel apparatus for barrel plating
摘要 <p>A barrel apparatus (11) for barrel plating in which a barrel having openings at both ends is used, a workpiece (W) is accommodated inside the barrel and immersed in a plating liquid, power is supplied to a negative electrode (14) that is arranged inside the barrel from the opening and a positive electrode that is arranged in the plating liquid, and the barrel is rotated about a center shaft while electroplating is performed, wherein, the internal positive electrode (15) is arranged at a position of the upper portion and to the left that is away from the workpiece inside the barrel against the workpiece (W) that is deposited at the lower portion to the right inside the barrel when the barrel (11) is seen from the rear portion in a direction that rotates to the left or is arranged at a position of the upper portion and to the right that is away from the workpiece inside the barrel against the workpiece that is deposited at the lower portion to the left inside the barrel when the barrel is seen from the rear portion in a direction that rotates to the right.</p>
申请公布号 EP2436805(A1) 申请公布日期 2012.04.04
申请号 EP20110175733 申请日期 2011.07.28
申请人 MITAKA SEISAKU CO., LTD. 发明人 SUZUKI, MICHIMASA
分类号 C25D17/22 主分类号 C25D17/22
代理机构 代理人
主权项
地址