发明名称 Case of electronic device having antenna pattern embeded therein, mould and method for manufacturing the same
摘要 PURPOSE: A case of electronic device having antenna pattern embedded therein, a mold and a method for manufacturing the same are provided to solve weakness to external shock by burying a radiator in the case of an electronic device. CONSTITUTION: A radiator frame(210) is manufactured through injection molding. A radiation unit(220) comprises an antenna pattern(222) which is formed in one side of the radiator frame. The antenna pattern of a conductive material is formed in one side of the radiator frame. A case frame is injection-molded upward the radiation unit. The radiation unit is buried between the radiation frames.
申请公布号 KR101133314(B1) 申请公布日期 2012.04.04
申请号 KR20100044183 申请日期 2010.05.11
申请人 发明人
分类号 H01Q1/24;H01Q7/00;H04B1/38 主分类号 H01Q1/24
代理机构 代理人
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