发明名称
摘要 An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
申请公布号 JP4911975(B2) 申请公布日期 2012.04.04
申请号 JP20050505000 申请日期 2004.02.13
申请人 发明人
分类号 C08F283/01;C08F290/00;H01B1/20;H01B1/24;H01M8/02;H01M8/10 主分类号 C08F283/01
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