Systems and methods for forming a layer of sputtered material

摘要

The present disclosure describes a method of coating a substrate (110), the method including forming a layer (806) of sputtered material on the substrate (110). Forming the layer of sputtered material may include: sputtering material from at least one target (120) over the substrate (110); varying the relative position between the at least one target (120) and the substrate (110) to a first position (I), which first position is maintained for a predetermined first time interval; and varying the relative position between the at least one target and the substrate to a second position (II), which second position is maintained for a predetermined second time interval. The present disclosure further describes a system for coating a substrate.