| 摘要 |
PURPOSE: A porous punching mold device is provided to form a plurality of flow holes without burr on a panel body-floor tile assembly or a single-layer plate. CONSTITUTION: A porous punching mold device(1) comprises a lower die part(10), an upper die part(30), and a guide part(60). The lower die part comprises a plurality of punching pins(11), a lower base(12), and an upper plate(20). The upper die part comprises a lower plate which guides a plurality of counter pins(31) to ascend and descend along the punching pins. The guide part guides the coupling or decoupling of the lower and upper die parts. The guide part comprises a female portion including a hollow column(61a) provided to one of the lower and upper die parts and a male portion including guide members(63,82), a sleeve(64), and coil springs(23,27,47,65). The coil springs are fitted to the exterior of the guide members between the sleeve and one of the lower and upper die parts. |
