发明名称 |
Method for slicing workpiece |
摘要 |
The present invention is a method for slicing a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a wire row formed by a wire spirally wound between a plurality of wire guides and making the wire travel while supplying a slurry to a contact portion between the workpiece and the wire, wherein the workpiece is sliced with an axis direction of the workpiece inclined with respect to a plane formed by the wire row, after the workpiece is inclined in such a manner that a side far from the wire row plane is a side where the wire guides are to be axially expanded. As a result, there is provided a method for slicing that enable wafers having a good Warp shape to be obtained by precisely slicing a workpiece with a wire saw. |
申请公布号 |
US8146581(B2) |
申请公布日期 |
2012.04.03 |
申请号 |
US20090990985 |
申请日期 |
2009.06.04 |
申请人 |
KITAGAWA KOJI;TOMII KAZUYA;SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
KITAGAWA KOJI;TOMII KAZUYA |
分类号 |
B28D1/08 |
主分类号 |
B28D1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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