发明名称 Adhesive composition and film adhesive
摘要 Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.
申请公布号 US8148457(B2) 申请公布日期 2012.04.03
申请号 US20070514633 申请日期 2007.09.26
申请人 ASAI TAKAHIRO;MISUMI KOICHI;MIYANARI ATSUSHI;INAO YOSHIHIRO;NAKAMURA AKIHIKO;TOKYO OHTA KOGYO CO., LTD. 发明人 ASAI TAKAHIRO;MISUMI KOICHI;MIYANARI ATSUSHI;INAO YOSHIHIRO;NAKAMURA AKIHIKO
分类号 C08L31/00 主分类号 C08L31/00
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