发明名称 DIVIDING METHOD OF RESIN-ATTACHED BRITTLE MATERIAL SUBSTRATE
摘要 PURPOSE: A method for splitting a resin-attached brittle material substrate is provided to improve the dimensional precision of split pieces of a brittle material substrate by accurately extending cracks in a vertical direction. CONSTITUTION: A method for splitting a resin-attached brittle material substrate comprises the steps of: forming grooves(G) in a predetermined split position of the resin side of a resin-attached brittle material substrate(10), forming a scribe line in a predicted split position of the substrate side of the resin-attached brittle material substrate, and splitting the resin-attached brittle material substrate along the scribe line.
申请公布号 KR20120031429(A) 申请公布日期 2012.04.03
申请号 KR20110075600 申请日期 2011.07.29
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 HASHIMOTO TAICHI;MURAKAMI KENJI;TAKEDA MASAKAZU
分类号 B28D5/00;B26F3/00;H05K3/00 主分类号 B28D5/00
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