发明名称 |
DIVIDING METHOD OF RESIN-ATTACHED BRITTLE MATERIAL SUBSTRATE |
摘要 |
PURPOSE: A method for splitting a resin-attached brittle material substrate is provided to improve the dimensional precision of split pieces of a brittle material substrate by accurately extending cracks in a vertical direction. CONSTITUTION: A method for splitting a resin-attached brittle material substrate comprises the steps of: forming grooves(G) in a predetermined split position of the resin side of a resin-attached brittle material substrate(10), forming a scribe line in a predicted split position of the substrate side of the resin-attached brittle material substrate, and splitting the resin-attached brittle material substrate along the scribe line.
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申请公布号 |
KR20120031429(A) |
申请公布日期 |
2012.04.03 |
申请号 |
KR20110075600 |
申请日期 |
2011.07.29 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. |
发明人 |
HASHIMOTO TAICHI;MURAKAMI KENJI;TAKEDA MASAKAZU |
分类号 |
B28D5/00;B26F3/00;H05K3/00 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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