发明名称 |
Hybrid composite wafer carrier for wet clean equipment |
摘要 |
A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.
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申请公布号 |
US8146902(B2) |
申请公布日期 |
2012.04.03 |
申请号 |
US20070743516 |
申请日期 |
2007.05.02 |
申请人 |
CHENG WING LAU;CHENG, LEGAL REPRESENTATIVE HELEN;KHOLODENKO ARNOLD;LAM RESEARCH CORPORATION |
发明人 |
CHENG WING LAU;CHENG, LEGAL REPRESENTATIVE HELEN;KHOLODENKO ARNOLD |
分类号 |
B23Q3/00 |
主分类号 |
B23Q3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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