Resin ejection nozzle, resin encapsulation method, and electronic part assembly

摘要

A resin ejection nozzle is scanned over a substrate on which an electronic part is mounted, and ejects an encapsulation resin to an encapsulation area of the substrate. The resin ejection nozzle comprises an ejection part adapted to eject the encapsulation resin, the ejection part having a longitudinal direction which is perpendicular to a direction of movement of the nozzle. An ejection hole part is adapted to cause the encapsulation resin to contact a substantially half area of a side of the electronic part which lies at right angles to the direction of movement of the nozzle. A remaining portion of the side of the electronic part is gradually contacted by the encapsulation resin after the substantially half area of the side of the electronic part is contacted by the encapsulation resin.