Method for fabricating a semiconductor chip panel

摘要

The method includes providing a plurality of semiconductor chips and placing the plurality of semiconductor chips on a carrier. A compression molding apparatus is provided that includes a first tool and a second tool. The carrier is placed on the first tool of the compression molding apparatus and the semiconductor chips are encapsulated in a mold material by compression molding. During compression molding a heat transfer from the first tool to an upper surface of the carrier is delayed.