发明名称 |
Anisotropic conductive material, connected structure, and production method thereof |
摘要 |
An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is formed by dispersing conductive particles in an insulating binder. The minimum melt viscosity [&eegr;0] thereof is in a range of from 1×102 to 1×106 mPa·sec, and satisfies the following equation (1): 1<[&eegr;1]/[&eegr;0]≦̸3  (1) where in the equation (1), [&eegr;0] represents the minimum melt viscosity of the anisotropic conductive material, and [&eegr;1] represents a melt viscosity at a temperature T1 which is 30° C. lower than a temperature T0 at which the minimum melt viscosity is exhibited. |
申请公布号 |
US8148641(B2) |
申请公布日期 |
2012.04.03 |
申请号 |
US20080451501 |
申请日期 |
2008.04.15 |
申请人 |
TANAKA YOSHITO;YAMAMOTO JUN;SONY CORPORATION;SONY CHEMICAL & INFORMATION DEVICE CORPORATION |
发明人 |
TANAKA YOSHITO;YAMAMOTO JUN |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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