发明名称 MULTIPLE RESIN-LAYERED SUBSTRATE AND METHOD OF MANUFACTURE OF MULTIPLE RESIN-LAYERED SUBSTRATE
摘要 <p>A resin multilayer substrate includes a component-containing layer and a thin resin layer stacked on a surface of the component-containing layer. The resin multilayer substrate further includes a surface electrode located on a surface opposite to the surface of the thin resin layer stacked on the component-containing layer, a first via conductor provided in the component-containing layer, which includes an end reaching one surface of the component-containing layer, and a second via conductor provided in the thin resin layer, which includes a first end electrically connected to the surface electrode and a second end electrically connected to the via conductor. A portion of the thin resin layer in contact with the second via conductor defines a projection projecting into the first via conductor.</p>
申请公布号 KR20120031307(A) 申请公布日期 2012.04.02
申请号 KR20127003363 申请日期 2010.08.24
申请人 MURATA MANUFACTURING CO., LTD. 发明人 ARAI MASASHI;NISHIHARA MAYUKO
分类号 H05K3/46;H01L23/12;H05K1/11;H05K3/40 主分类号 H05K3/46
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