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发明名称
Heat Conductive Silicone Composition for Heat Dissipation and Method for Manufacturing a Heat-dissipating Structure
摘要
申请公布号
KR101127285(B1)
申请公布日期
2012.03.30
申请号
KR20050005903
申请日期
2005.01.21
申请人
发明人
分类号
C08L83/04;C09K3/10;C08K3/00;C08K5/05;C08L83/05;C08L83/07;H01L23/373
主分类号
C08L83/04
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