发明名称 |
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND A METHOD FOR MANUFACTURING THE SAME |
摘要 |
In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased. |
申请公布号 |
US2012073129(A1) |
申请公布日期 |
2012.03.29 |
申请号 |
US201113241863 |
申请日期 |
2011.09.23 |
申请人 |
ABE TOMORO;NISHIOKA MASATO;MURATA MANUFACTURING CO., LTD. |
发明人 |
ABE TOMORO;NISHIOKA MASATO |
分类号 |
H01R43/00 |
主分类号 |
H01R43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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