| 摘要 |
<p>Disclosed are a liquid resin composition which contains a (A) liquid epoxy resin, (B) an amine hardener, (C) core-shell rubberparticles, and (D) an inorganic filler, wherein the content of the solid components with respect to the total liquid resin composition is equal to or more than 65 % by weight, and a semiconductor device using the liquid resin composition.</p> |
