| 发明名称 |
LIGHT EMITTING DIODE PACKAGE UNIT, METHOD FOR MANUFACTURING THE SAME AND BACKLIGHT |
| 摘要 |
A light emitting diode package unit, a method for manufacturing the same and a backlight are disclosed. The light emitting diode package unit comprising a LED chip and a light uniformization structure formed above the LED chip in the direction of exiting light.
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| 申请公布号 |
US2012075840(A1) |
申请公布日期 |
2012.03.29 |
| 申请号 |
US201113241925 |
申请日期 |
2011.09.23 |
| 申请人 |
SUN HAIWEI;LIU JIA;CAI SITE;BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
SUN HAIWEI;LIU JIA;CAI SITE |
| 分类号 |
G09F13/08;H01L33/58 |
主分类号 |
G09F13/08 |
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