ELECTRIC DEVICE AND METHOD OF BONDING CHIP TO EXTERNAL ELECTRIC CIRCUIT

摘要

A method of bonding a chip (32) to an external electric circuit is provided. The conductors (36) of the external electric circuit intended for connection to the chip are formed with physical extensions (37) and the chip is directly bonded to these extensions. An electric device comprising at least one chip (32) and an external electric circuit is also provided. The chip is directly bonded to the physical extensions (37) of the conductors (36) of the external electric circuit.