| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor of high quality which maintains signal quality. <P>SOLUTION: The semiconductor device comprises a wiring board 10, a semiconductor chip 12 mounted on the wiring board 10, a mold resin 14 formed inside the wiring board 10, when viewed from above, for encapsulating the semiconductor chip 12, distribution lines 22, 24 provided on the wiring board 10 on a face on which the semiconductor chip 12 is mounted and connecting with the semiconductor chip 12, plating lead-out lines 32, 34 formed so as to cross a periphery of the mold resin 14, and a shield pattern 60 formed around the distribution line 22. The shield pattern 60 is formed so as to cross the periphery of the mold resin 14 and separated at the crossing portion with the periphery of the mold resin 14 into more than one portion along the periphery of the mold resin 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
