| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure method, an exposure device, and a manufacturing method of a semiconductor device, capable of supplying an optimal exposure amount distribution on a wafer even if a dimensional error exists between a device pattern and an exposure amount adjustment test pattern. <P>SOLUTION: The exposure method includes: placing a photo mask having a mask pattern including the device pattern and the exposure amount adjustment test pattern; acquiring relation information between the exposure amount and the dimension variation amount of a resist pattern on the wafer, using the test pattern of the photo mask; measuring the dimensional error between the device pattern and the test pattern; setting exposure amount distribution information on the mask pattern, based on the relation information and the dimensional error; and exposing the resist on the wafer based on the exposure amount distribution information to transfer the mask pattern to the resist. <P>COPYRIGHT: (C)2012,JPO&INPIT |
