| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently replace a defective cell caused after packaging with a redundant cell. <P>SOLUTION: A semiconductor device 10 comprises a plurality of chips 100, a chip 200 for controlling the chips 100, and internal wiring 400 for connecting the chips 100 with the chip 200. Each chip 100 includes an optical fuse 120, a latch circuit 101 for storing information of the optical fuse 120, a latch circuit 102 for storing information of an electric fuse 220 supplied from the chip 200 via the internal wiring 400, and a selection circuit 151 for selecting the information of one of the latch circuits 101 and 102. Based on the selected information, the chip 100 generates a redundancy determination signal HIT. According to the present invention, since the information of the electric fuse is transmitted from the chip 200 to the chip 100 via the internal wiring, the provision of the electric fuse for the chip 100 is not necessary and the transmission does not need an external terminal, so that the startup time will not increase. <P>COPYRIGHT: (C)2012,JPO&INPIT |
