| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser processing method and a laser processing apparatus in which variation in the impurity diffusion region of a substrate can be reduced. <P>SOLUTION: The laser processing apparatus comprises a laser oscillator 400 which oscillates a laser beam B with which a work piece 600 is irradiated, and a control system 100 which controls overall operation of the laser processing apparatus. The control system 100 adjusts the position of the surface of the work piece 600 so that the surface of the work piece 600 is located at the focus position of the laser beam B. Furthermore, the control system 100 controls intensity of the laser beam B oscillated by the laser oscillator 400 according to the required diffusion depth or diffusion width. <P>COPYRIGHT: (C)2012,JPO&INPIT |
