| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce degradation in signal waveform caused by the wiring load capacity of a signal wiring pattern. <P>SOLUTION: The printed circuit board has an insulating layer, and a signal wiring layer and a reference wiring layer laminated to sandwich the insulating layer. A signal wiring pattern is formed on the signal wiring layer, and a reference wiring pattern for transmitting a reference voltage is formed on the reference wiring layer. At least a part (102a) of the reference wiring pattern faces at least a part (101a) of the signal wiring pattern while sandwiching the insulating layer. One or a plurality of missing parts (111) are formed at a part (121) of the reference wiring pattern facing the signal wiring pattern. <P>COPYRIGHT: (C)2012,JPO&INPIT |
