| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof ensuring an electrical connection between a floating structure and a support substrate by realizing abutment of the floating structure on the support substrate without another abutment. <P>SOLUTION: In the semiconductor device including the support substrate composed of a semiconductor, an insulation layer provided on the support substrate and an active layer provided on the insulation layer, the floating structure is formed on a part of the active layer by removing a part of the insulation layer by etching, and subsequently, the floating structure is made to abut on the support substrate to be conducted with each other by compressing a conductive member to the active layer having at least the floating structure. <P>COPYRIGHT: (C)2012,JPO&INPIT |
